Advanced Packaging Project | NYU Tandon School of Engineering

Project Type:
Product/Market Development
Project Sponsor:

International Manufacturer


Students helped a company leverage their position as a global leader in x-ray tube manufacturing to advance in thee semiconductor industry. The company wanted to provide value and support for their partners and stakeholders to lead to sustained growth. Students analyzed market growth by defining the market size of the Advanced Packaging and X-ray Inspection Systems Market, identified key stakeholders in the advanced packaging industry, and identified defects in the identification and inspection processes. Finally, students analyzed the future significance of X-ray inspection in defect detection within semiconductor components.


Keywords: X-Ray, Manufacturing, Market Growth, Advanced Packaging, Inspection, Semiconductor