Goals:
Develop an understanding of measurement techniques required for chip testing and associated calibration using a vector network analyzer and probe station. Component design and test of two, three and four-port RF devices. Development of new measurement techniques using sub-THz probe stations. Simulation of advanced components using industry standard CAE tools.
Methods & Technologies:
- Simulation and component modeling using Ansys HFSS, Keysight Pathwave, Cadence Virtuoso Studio
- Calibration and Measurement using Vector Network Analyzers (VNA)
- Chip testing on probe stations from FormFactor and MPI
SubTeams:
- Simulation
- PCB Fabrication
- VNA Calibration
- Chip Design
Faculty Advisor
- Michael Knox
- Email: mek407@nyu.edu
Areas of Interest:
- Electrical Engineering
- Computer Engineering
- Mechanical Engineering
Primary Instructors
- Mike Knox (NYU Wireless)
- Email: mikeknox@nyu.edu