Tandon in the News
NYU Researchers Find Cybersecurity Risks in 3D Printing
A new report from NYU researchers found that printing orientation and insertion of fine defects could affect the outcome of 3D printed products.
- Sri Ravipati for Campus Technology July 12th, 2016
- Source: https://campustechnology.com/articles/2016/07/12/nyu-researchers-find-cybersecurity-risks-in-3d-printing.aspx
The 3D printing industry is currently a $4 billion business, with that number expected to quadruple by 2020. As more and more manufacturers continue to adopt this technology, researchers at New York University (NYU) say that new cybersecurity methods and tools are needed to properly monitor the quality of 3D printed products. A team of cybersecurity and materials engineers at NYU’sTandon School of Engineering published a paper that explores the potential risks that exist in the cyber-physical environment of 3D printing.