Events

The American Semiconductor Innovation Coalition (ASIC)

Lecture / Panel
 
For NYU Community

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Speaker:

Dr. Douglas A. Grose

The American Semiconductor Innovation Coalition (ASIC)

Title:

The American Semiconductor Innovation Coalition (ASIC)

Abstract:

The CHIPS and Science Act, signed into law by President Biden August 9, 2022, includes significant funding for a once in a generation opportunity to strengthen the U.S. microelectronics ecosystem that is facing significant global competition.

The CHIPS and Science Act provides funding for the Department of Commerce/NIST to invest $11 billion over 5 years in semiconductor R&D, including a National Semiconductor Technology Center (NSTC) and a National Advance Packaging Manufacturing Program (NAPMP). Included in the CHIPS and Science Act is $39 billion financial support for domestic semiconductor manufacturing,

The American Semiconductor Innovation Coalition (ASIC), represents more than 160 businesses, start-ups, universities, national labs, non-profits dedicated to bringing the best research and development to the National Semiconductor Technology Center (NSTC) and the National Advanced Packaging Manufacturing Program (NAPMP). 

Dr. Doug Grose, representing ASIC, will discuss the ASIC vision for the NSTC and NAPMP. 

Bio:

Douglas Grose is a technologist who built his early career at IBM for over 20 years. 

From 2006 through 2009, he was the Senior Vice President of Technology Development, Manufacturing and Supply Chain at Advanced Micro Devices (AMD).

Dr. Grose helped direct the formation of GLOBALFOUNDRIES. He was the CEO of GLOBALFOUNDRIES from 2009-2011. 

Dr. Grose was appointed President of NY CREATES in 2019 and transitioned to Chair of the Board of NY CREATES in 2021. 

In semi-retirement, Dr. Grose is supporting the American Semiconductor Innovation Coalition (ASIC), guiding a response for the CHIPS and Science Act,  National Semiconductor Technology Center (NSTC) and National Advanced Packaging Manufacturing Program (NAPMP).

Dr. Grose graduated from Rensselaer Polytechnic Institute with an MBA and a BS, MS and PhD in Materials Engineering.